Quartz Laser Drilling Services — Micron-Scale Accuracy, Industrial-Grade Throughput

Transform your industrial applications with John Moncrieff Ltd’s state-of-the-art quartz laser drilling. When microscopic precision meets industrial strength, possibilities multiply. Leveraging next-generation laser systems, tooling control, and in-process metrology, we deliver unrivalled accuracy and repeatability in precision drilling for fused silica and quartz components.

Core Capabilities

• Ultra-Fine Holes: Down to Ø 0.05 mm (50 µm) nominal.
• Thickness Envelope: From 0.03 mm thin stock up to 10 mm.
• Dimensional Precision: Feature tolerance to ±0.015 mm (process-dependent).
• Working Area: Parts and panels up to 1,500 mm in length.
• Geometry Control: Low-taper bores, countersinks, blind holes, and through-vias.
• Array Processing: High-density patterns for microfluidics, filters, and nozzle plates.
• Edge Quality: Clean exits with post-polish options for optical-grade finishes.

Applications

• Semiconductor & Microfluidics: Via arrays, capillaries, and wafer-level features.
• Optics & Photonics: Precision apertures, pinholes, and alignment features.
• Sensing & Analytics: Flow cells, probe ports, and micro-orifices.
• Process Windows: High-temperature, chemically resistant viewports with engineered vents.
• Scientific Instrumentation: Custom manifolds, nozzle plates, and jetting components.

Technical Envelope

• Materials: High-purity fused silica / synthetic quartz (>99.99% SiO₂), JGS1/JGS2/JGS3 equivalents.
• Feature Density: Tight-pitch hole arrays with controlled spacing and uniformity.
• Thermal Management: Pulse-tailoring to minimise micro-cracking and heat-affected zone.
• Flatness & Fixturing: Precision clamping for low-bow panels and thin sheets.
• Secondary Ops: Chamfering, bevels, countersinks, and optical-edge polishing on request.

Quality & Compliance

• ISO 9001: BSI-audited quality system with full material traceability.
• In-Process Metrology: CMM / digital vision inspection and SPC reporting.
• Documentation: Dimensional reports, CoCs, and bespoke QA plans available.
• Clean Handling: Clean-area packaging and optional Class 1000 protocols.
• Double QC: Incoming and final inspection to lock in repeatability